JPH0310704Y2 - - Google Patents

Info

Publication number
JPH0310704Y2
JPH0310704Y2 JP17610984U JP17610984U JPH0310704Y2 JP H0310704 Y2 JPH0310704 Y2 JP H0310704Y2 JP 17610984 U JP17610984 U JP 17610984U JP 17610984 U JP17610984 U JP 17610984U JP H0310704 Y2 JPH0310704 Y2 JP H0310704Y2
Authority
JP
Japan
Prior art keywords
header
cooling
bellows
package
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17610984U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6190290U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17610984U priority Critical patent/JPH0310704Y2/ja
Publication of JPS6190290U publication Critical patent/JPS6190290U/ja
Application granted granted Critical
Publication of JPH0310704Y2 publication Critical patent/JPH0310704Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP17610984U 1984-11-20 1984-11-20 Expired JPH0310704Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17610984U JPH0310704Y2 (en]) 1984-11-20 1984-11-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17610984U JPH0310704Y2 (en]) 1984-11-20 1984-11-20

Publications (2)

Publication Number Publication Date
JPS6190290U JPS6190290U (en]) 1986-06-12
JPH0310704Y2 true JPH0310704Y2 (en]) 1991-03-15

Family

ID=30733706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17610984U Expired JPH0310704Y2 (en]) 1984-11-20 1984-11-20

Country Status (1)

Country Link
JP (1) JPH0310704Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9743558B2 (en) * 2014-10-14 2017-08-22 Intel Corporation Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages

Also Published As

Publication number Publication date
JPS6190290U (en]) 1986-06-12

Similar Documents

Publication Publication Date Title
US4791983A (en) Self-aligning liquid-cooling assembly
US5808236A (en) High density heatsink attachment
US5768104A (en) Cooling approach for high power integrated circuits mounted on printed circuit boards
US6239972B1 (en) Integrated convection and conduction heat sink for multiple mounting positions
US5465192A (en) Cooling apparatus for integrated circuit chips for preventing forcible contact between a cooling member and the chips
US5653280A (en) Heat sink assembly and method of affixing the same to electronic devices
KR940009178B1 (ko) 전자부품 보호용 브라켓조립체
US5276961A (en) Demountable tape-automated bonding method
US20030016500A1 (en) Attachment of a single heat dissipation device to multiple components with vibration isolation
US4768352A (en) Cooling structure for integrated circuits
US20020036341A1 (en) Printed board unit
JPH0310704Y2 (en])
KR20070055323A (ko) 집적회로 홀더, 시스템 보드 및 이를 위한 집적회로 패키지
US20030160319A1 (en) Solid assembly of flip-chip package attached to heat removal device and method of manufacturing same
US5805418A (en) Cooling cap method and apparatus for tab packaged integrated circuits
US20070074852A1 (en) Heat sink
EP1648213B1 (en) Heat dissipation for multiple integrated circuits mounted on a printed circuit board
KR0148076B1 (ko) 양면 연배열 인쇄회로기판의 받침대
CN221467978U (zh) 一种pcb散热装置
JP2005503005A (ja) 半田付けしていないpcb組み立て品
CN215582471U (zh) 一种机箱内支撑式pcb板的安装结构
JP2001284491A (ja) プラスチック基板
CN217984840U (zh) 节能型电源板卡
KR910004738Y1 (ko) 방열판을 구비한 인쇄회로기판
US20020036511A1 (en) Printed circuit board and method of manufacturing the same